The basic_ble_oad_offchip (in peripheral role) executes a Link Terminate when the start OAD is sent via bTool.

Test procedure:

BTool version 1.44.01

1) Flash:

1. mcuboot_offchip from {SDK_INSTALL_DIR}

   \examples\rtos\LP_EM_CC2340R5\ble5stack\hexfiles.

2. flash the OAD offchip application to bin address 0x6000

2) Open Btool with CC26X2R1 as host_test Scan & create connection

3) Pair (If RPA with Public ID):

1. Mark  Bonding Enabled checkbox
2. Mark Authentication (MITM) Enabled checkbox
3. Enter Passkey (1-6)

4) Load different OAD offchip application .bin and Mark "OAD To external Flash"

5) Click start then you will get the OAD not successful in red in BTOOL