Uploaded image for project: 'Embedded Software & Tools'
  1. Embedded Software & Tools
  2. EXT_EP-11444

Bonding fails if LTK not updated in the linkDB

XMLWordPrintable

    • Icon: Bug Bug
    • Resolution: Fixed
    • Icon: High High
    • SimpleLink Lowpower SDK F3 BLE5 Stack
    • BLE_LOKI-755
    • BLE Stack BLE5-3.2.2
    • Hide
      BLE Stack BLE5-3.2.2
      BLE Stack BLE5-3.2.2 RC1
      Show
      BLE Stack BLE5-3.2.2 BLE Stack BLE5-3.2.2 RC1
    • CC23xx

      Description:

      • When central initiates bonding after connection established, the controller send failure event due not having the LTK for the connection immediately, and doesn't wait the host for sending it to the controller.
      • Gap_Bond must be executed between the connection and the starting the bonding process to provide the connection handle the needed LTK.
      • if there is no enough time , then providing the keys is impossible

      Reproduce instruction:

      flash host_test on peripheral device.

      • connect with central (via HCI)
      • initiate bonding from central - 
      • peripheral will invoke this event "HCI_Command_Complete_LE_Long_Term_Key_Requested_Negative_Reply_Event"

            syncuser TI User
            syncuser TI User
            Votes:
            0 Vote for this issue
            Watchers:
            2 Start watching this issue

              Created:
              Updated:
              Resolved: