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Bug
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Resolution: Fixed
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High
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SimpleLink CC13x2-26x2 SDK BLE5 Stack
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BLE_AGAMA-3617
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CC26X2R1
When the GAPBOND_LRU_BOND_REPLACEMENT in enabled and a new bond record is added after the bonding list is full and the resolving list has reached its limit, the resolving list does not overwrite LRU entry with the IRK of the new device.
Fix:
If the GAPBOND_LRU_BOND_REPLACEMENT is enabled and a new bond record is added to the resolving list using an existing bond index, then:
Erase the current bond (form the NV and from the RL)
Add a new bond record.