Uploaded image for project: 'Embedded Software & Tools'
  1. Embedded Software & Tools
  2. EXT_EP-10421

Add new APIs to GAP bond manager to access bonding records

XMLWordPrintable

    • Icon: Enhancement Enhancement
    • Resolution: Implemented
    • Icon: Medium Medium
    • SimpleLink CC13x2-26x2 SDK BLE5 Stack
    • BLE_AGAMA-3300
    • BLE Stack BLE5-2.2.2 RC3
    • Hide
      BLE Stack BLE5-2.2.2 RC4
      BLE Stack BLE5-2.2.2
      Show
      BLE Stack BLE5-2.2.2 RC4 BLE Stack BLE5-2.2.2
    • CC26X2R1

      Add new APIs to GAP bond manager: read and write bonding records to and in SNV.

      • Add new APIs:
        • gapBondMgrReadBondRec - Read bond record from the NV
        • gapBondMgrImportBond - Saves external bond record to the NV
          Both functions are public and defined in gapbondmgr.h
      • Move the following items from gapbondmgr.c to gapbondmgr.h to make them publically accessible:
        • #define GAP_BOND_REC_ID_OFFSET
        • #define GAP_BOND_LOCAL_LTK_OFFSET
        • #define GAP_BOND_DEV_LTK_OFFSET
        • #define GAP_BOND_DEV_IRK_OFFSET
        • #define GAP_BOND_DEV_CSRK_OFFSET
        • #define GAP_BOND_DEV_SIGN_COUNTER_OFFSET
        • #define GAP_BOND_REC_IDS
        • #define GAP_BONDED_STATE_AUTHENTICATED
        • #define GAP_BONDED_STATE_SERVICE_CHANGED
        • #define GAP_BONDED_STATE_CAR
        • #define GAP_BONDED_STATE_SECURECONNECTION
        • #define GAP_BONDED_STATE_RPA_ONLY
        • typedef struct {...} gapBondLTK_t;
        • typedef struct {...} gapBondRec_t;
        • typedef struct {...} gapBondCharCfg_t;

            syncuser TI User
            syncuser TI User
            Votes:
            0 Vote for this issue
            Watchers:
            2 Start watching this issue

              Created:
              Updated:
              Resolved: