The MMC0 interface has the potential for write failures when issuing multiple block writes operating in HS200 mode with excessive IO supply noise.

To minimize IO supply noise follow below best practices and refer to the linked app note:

• Use wide power planes/pours adjacent to ground layers with a thin dielectric between them.
• Place power planes/pours and adjacent ground planes as close to the surface of the powered components as possible.
• Use a wide variety of decoupling capacitor values and place low ESL capacitors as close to the decoupled device as possible.
• Use one decoupling capacitor per power pin.
• Use short and wide traces to decoupling capacitors and power/ground vias.
• Sitara™ Processor Power Distribution Networks: Implementation and Analysis
  –
  Workaround to Implement:
  software recovery mechanism which re-issues the failed multiple block write with minimum 5us delay between blocks to reduce noise. One way to achieve this delay is using single block writes for the failed multiple block write

Fixed: https://git.ti.com/cgit/ti-linux-kernel/ti-linux-kernel/commit/?h=ti-linux-6.18.y&id=8830e3e74d20e91d65dc7d303256a51a16d80cfd